PACOPAD

Description

Proven worldwide performance since 1986
Operating temperature of 475°F/246°C for six hours
Two standard thicknesses of .035” (.89mm) and .055”(1.4mm) for custom Heat Input Control and optimal Pressure Equalization
Extremely low moisture to reduce liquid buildup in vacuum systems minimizing heat rise variability due to volatility
Uniform fiber formation and distribution for unmatched pressure equalization, micro Z-axis conformance and repeatable, consistent Heat Rise
Low fiber dusting and contamination
No resinous binders or fillers, essentially sulfur free, with no odor or solvents to pollute vacuum systems or the work environment
Environmentally friendly – suitable for re-pulping, land fill disposal or incineration

PACOPADS™are a line of press pads specifically engineered to improve the process of laminating rigid multi-layer and flexible Printed Circuit Boards. They serve two primary functions: to accurately control heat input and to equalize the pressure applied
to the panel surface. PACOPADS™ are a unique, cellulosic-based product, engineered specifically to meet the performance requirements of both Rigid Multilayer and Flexible Printed Circuit Board manufacturers. PACOPADS™ are manufactured on a highly specialized paper machine, using virgin fibers that guarantee a low density profile consistent across the entire area of the sheet. (See Press Probe Illustration) PACOPADS™ are vastly superior to commodity grade papers which vary significantly in weight, thickness, hard spots, contaminants, and moisture.