THERMOFILM

Description

Contaminate free release from High Temperature Laminates and Separator Plates
Rated for Operating Temperatures up to 650°F (343°C) for up to 2 Hours
Optimal thickness at 1.5 mils (38μm) for easy Handling
No embedded impurities
Extremely low X&Y Axis shrinkage
Minimal static potential
Essentially inert: no out-gassing, no plate residue, no inter-laminar adhesion influence, and no vacuum system contamination

A two-sided Release Film engineered for Ultra High Temperature PCB laminations requiring an easy clean release after elevated temperature lamination cycles.