SOLDER PASTE RMA SERIES
Solder Paste RMA Series is a RMA Type Solder Paste whose flux satisfies QQ-S-571E and the special solder powder contain very little oxide. After re-flow, the flux residue provides a highly reliable coating with excellent insulation resistance. Suitable for use of QFP with 0.3 mm pitch.
SOLDER PASTE SQL SERIES
Solder Paste SQL Series is designed for Low Melting Temperature. Their special features include:
SOLDER PASTE DISPENSER SERIES
Solder Paste Dispenser Series is designed for dispensing of Solder Paste from a syringe on the desire location.
SOLDER PASTE MULTI SPOT DISPENSER SERIES
Solder Paste Multi Spot Dispenser Series is specially design for dispensing on the land with inserted components. Dispensing of Solder Paste is done through multi nozzle and soldering by blowing multi spot air.
SOLDER PASTE SQW SERIES
Solder Paste SQW Series are water-soluble Solder Paste. Flux residue on printed circuit board can be cleansed with water.
SOLDER PASTE SOLDER BUMP SERIES
Solder Paste Solder Bump Series is developed for forming solder bump (pre-solder) on fine-pitch pads. Solder Paste is applied on the pads and after re-flow, it form a homogeneous solder bump.
SOLDER PASTE LF SERIES
Solder Paste LF Series is a Lead Free Solder Paste.
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ESE Industries (S) Pte Ltd is a manufacturer of Tamura electrochemical. It is our company policy to protect the environment and provide safe and healthy working condition for all our employees.
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